DISPERBYK® is a wetting and dispersing additive for solvent-borne systems . It is composed of a solution of a copolymer with acidic groups. This prod. Solution of a copolymer with acidic groups. Acts as a wetting and dispersing additive for aqueous and solvent-borne systems. Provides deflocculation through . Material Safety Data Sheet. DISPERBYK Version Revision Date 08/14/ Print Date 08/14/ 1 / SECTION 1. PRODUCT AND COMPANY.

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Any residues from these dispersants remaining in the cured metallic films will result in higher resistivities being obtained in the metal conductor that is formed because these dispersants and their decomposition products are non-conducting organic compounds, or insulators. Method for arranging particles and method for manufacturing light-emitting device.

Metallic inks may be formulated to yield metallic-films with high conductivity. The solution was agitated for at least 20 minutes to break up any agglomerated copper nanoparticles and to mix the dispersion.

In some cases, the dispersant that provides the disperby, performance at one step of the process may not provide the best performance at another step. In some cases, the dispersant disperbym be polyvinylpyrrolidone, polyethylene glycol, isostearyl ethylimidazolinium ethosulfate, oleyl ethylimidazolinium ethosulfate, or combinations thereof. A higher viscosity promotes forming of a dispersion suitable for ink-jet printing methods. Dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric disperbyj and a sintering additive.


Ink compositions involving near-infrared absorber dyes and use in ink jet dispsrbyk devices. In some cases, metal inks may be cured to obtain conductive metal films with resistivities close to those of the bulk metal conductor itself.

As shown in FIG. A dispersant may be selected such that the head group is chemically compatible with or preferentially associates with the nanoparticleand the tail group is chemically compatible with or preferentially associates with the vehicle solvent. Method for producing metal particles, ink composition and paste composition produced by the same.

A dosage of 0. Solderable metal finish for integrated circuit package leads and method for forming. A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent.

Contact permission Disperybk love to send you exclusive offers and the latest info relating to health and safety and safety data sheets by email and other electronic means. Conductive paste, curing method therof, method for fabricating antenna for contactless data transmitter-receiver, and contactless data transmitter-receiver.


The melted nanoparticles may fuse together. Solvents described above, or any combination thereof, may be used as vehicles for ink formulations including non-ionic and ionic dispersants.

DISPERBYK MSDS Download Health & Safety Software | Sevron

In certain implementations, the conductive ink includes a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof. Ink composition for preparing front electrode of solar cell and solar cell comprising the same. The film may be substantially free of imperfections, such as pin holes.

Some or all of these steps are described in detail in the examples below. If the light intensity is sufficiently high for example, on the order of a few Joules per square centimeter and the pulse is sufficiently short for example, on the order of microseconds or lessthen the optical energy delivered to the film may melt the metal nanoparticles.

Alcohols including isopropanol IPAisobutyl alcohol, ethanol, polyvinyl alcohol, ethylene glycol, and combinations thereof were used.

Amines, polyvinylpyrrolidone PVPpolyethylene glycol, isostearyl ethylimidazoliniurn ethosulfate, and oleyl ethylimidazolinium ethosulfate were used as dispersants.

Metallic nanoparticle cluster ink and method for forming metal pattern using the same. Efficient and environmentally-friendly antibacterial and mildewproof inorganic composite nano-powder slurry and its preparation method.

The properties and amounts of these additives and modifiers may be different for each conductive metallic ink, for each substrate, for each printing method, and the like. In each case, the multifunctional structure allows for low concentrations to be used to achieve stable nanoparticle dispersions. The neutralized form of this acidic polymer is referred to as HCS—N.

Additives and modifiers used in conductive metallic inks may act as rheology modifiers, wetting agents, adhesion promoters, binders, defoaming agents, leveling agents, ionic strength modifiers, and the like.

Electrical circuit component formed of a conductive liquid printed directly onto a substrate. Steps to form a stable dispersion from a metallic nanopowder may include wetting the powder, breaking up agglomerates in the powder de-agglomeratingand stabilizing the dispersed particles to inhibit flocculation.

Dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a thermally cleavable agent. The ink of claim 1further comprising a leveling additive.


Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same. However, those of skill in the art should, in light of the present disclosure, appreciate that many changes may be made in the specific embodiments that are disclosed and still obtain a like or similar result without departing from the spirit and scope of the invention.

Byk makes their documentation available in the regions indicated below: If the conductive polymer is also the dispersant for metallic nanoparticles, the resistivity of the resulting metallic films may be significantly reduced, due at least in part to limited or no additional contamination from residual non-conducting dispersants.


It is composed of a solution of a copolymer with acidic groups. The ink was coated on a polyimide substrate to form a film. During the curing process, the copper nanoparticles are fused during the very short curing time, while little or no damage occurs to the substrate, and copper oxides that are present on the surface of the copper nanoparticles are at least partially photoreduced.

In the presence of water, an acid-base reaction may occur, forming a hydroxide layer on the surface. Method for manufacturing transparent electrode, transparent electrode, and organic electronic element. In contrast; at high pH, protons may be removed to produce a negatively charged surface. The ink of claim 1further comprising an adhesion promoter. The following exemplary non-ionic polymers are useful as modifiers in the formulation of inks that are photonically curable to yield good conductors:.

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Method for reflowing a metal plating layer of a contact and contact formed thereby. Nickel-containing and corrosive printable paste, as well as methods of forming electrical contacts in the manufacture of a solar cell. Lower concentrations of the dispersant are favorable because less organic material remains after the curing process. Byk invests approximately 7. Simply fill in your email address below and click ‘Send To My Email’ get your data sheet emailed to you.